CVD / ALD / Etching Process

Qulee RGM2 Series

RGM2-202 RGM2-302

This process monitoring system has been developed for various kinds of applications such as etch, CVD and other reactive gas processes.

Using ULVAC's original ion source and pumping system enables you to achieve stable measurement results.


Long-term stable measurements results.

Communication interface Ethernet compatible.

Closed Ion Source Utilizing a Magnetic Field :
Soft ionization provides less gas dissociation and higher sensitivity. Decomposition and adsorption due to thermal reactions are minimized in the ionization chamber.

Short distance between the process chamber and ion source allows quick-response to analysis.

Wide pressure range from 10-6 to 13 kPa is available. (Choice of orifices).

No need for a PC. "One Click" function.

Max 120°C. High-temperature baking.

Electron bombard degas.

Protection and maintenance of ion source and secondary electron multiplier.

Traceability of analysis tube (patent pending).

Various Leak Tests are Available (Helium leak test, air leak test, leak up).

Capable of total pressure measurement (External ionization gauge GI-M2).

This software is included and compatible with (Windows 8/10/11).



For etching and ALD and CVD process.

Monitoring reactive gases during the process.

End-point monitoring for etching and cleaning processes.

Residual gas analyzing.

Leak testing.


Contact us for more product information and specifications.


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