Backside Metalization Sputtering System
SRH Series
SRH Series is a production system for the deposition of metallic films for power devices, WL-CSP, UBM or similar applications.
SRH Series is a production system for the deposition of metallic films for power devices, WL-CSP, UBM or similar applications.
Applicable substrate size: Ø125 to 200mm. |
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Capable of auto-transfer for Ultra-thin Si wafer up to 50µm thickness. |
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Up to 5 unique process recipes. |
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Sputter-Etching process developed by ISM. |
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Efficient water-cooling mechanism by ESC method is available. |
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WL-CSP (seed layer of electrolytic plating). |
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UBM (Barrier metal). |
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Contact us for more product information and specifications.