Backside Metalization Sputtering System

SRH Series

SRH Series is a production system for the deposition of metallic films for power devices, WL-CSP, UBM or similar applications.


Applicable substrate size: Ø125 to 200mm.

Capable of auto-transfer for Ultra-thin Si wafer up to 50µm thickness.

Up to 5 unique process recipes.

Sputter-Etching process developed by ISM.

Efficient water-cooling mechanism by ESC method is available.



WL-CSP (seed layer of electrolytic plating).

UBM (Barrier metal).


Contact us for more product information and specifications.


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