Multi-chamber Sputtering System

MLX™-3000N

MLX™-3000N meets customer’s complicated requests with superior process flexibility and controllability, and excellent cost performance.





Features

Wafer size: 3 to 8 inches (75 to 200mm)

Accurate film quality control is available with precise parameter control under a contaminated free environment

   

Applications

Metallization for semiconductor devices such as Power devices, etc.

     



Contact us for more product information and specifications.

  




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