Multi-chamber Sputtering System


MLX™-3000N meets customer’s complicated requests with superior process flexibility and controllability, and excellent cost performance.


Wafer size: 3 to 8 inches (75 to 200mm)

Accurate film quality control is available with precise parameter control under a contaminated free environment



Metallization for semiconductor devices such as Power devices, etc.


Contact us for more product information and specifications.


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