Load-lock Type Sputtering System


Load-lock type Sputtering System CS 200 is for Research & Development and small production applications.


Substrate transfer capability up to Ø300mm (Deposition performance up to Ø200mm).

Automatic multi-layered deposition by recipe control.

Capable of automatic substrate transfer by simply loading the substrate on to manipulator in the Load-lock chamber.

Cassette chamber is available with five substrates stockers inside the load-lock chamber.

Co-sputtering and Multi-layer deposition using multi-cathodes.

Bias-sputtering was available with an optional substrate Bias power supply.



Research & Development.

Small production purpose.


Contact us for more product information and specifications.


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