A Batch System to Remove Native Oxide


Batch-type equipment of chemical dry cleaning for removal of native oxide in Narrow and Deep-contact patterns of advanced semiconductors.


Damage-free (remote plasma and low-temperature process)

High throughput and low TCO.

Processing in batches of fifty wafers.

Superior uniformity of etching (5% or less per batch).

Easy maintenance.

Small footprint compare to cluster-type equipment.

50% lower self-aligned contact resistance compared to the current wet process.

The Smallest footprint.



Pre-cleaning for self-aligned contact (SAC) formation.

Pre-cleaning for capacitor formation.

Pre-cleaning for epitaxial growth.


Contact us for more product information and specifications.


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