Dry Etching System for Opto-Devices, MEMS


Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.


ICP type etching chamber, CCP or Ashing chamber is also selectable as 2nd chamber.

Low process pressure, high-density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT, etc.

Good profile control and surface roughness.

Good performance of deep SiO2 etching with PR.

High etching rate of Quartz > 1µm/min, Pyrex > 0.8 µm/min.

Excellent uniformity control.



Optical Devices (Wave guide, amplifier, optical switch etc), Micro lens, Photonics, µ-TAS etc.


Contact us for more product information and specifications.


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