Dry Etching System for R&D


Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.


Low process pressure, high-density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT, etc.

Good profile control and surface roughness.

Good performance of deep SiO2 etching with PR.

High etching rate of Quartz > 1µm/min, Pyrex > 0.8 µm/min.

Excellent uniformity control.

Cassette chamber is selectable as an option.



Optical Devices (Wave guide, amplifier, optical switch etc), Micro lens, Photonics, µ-TAS etc.


Contact us for more product information and specifications.


2024 ULVAC Singapore Pte Ltd. All rights reserved.