Load-lock Type Plasma-CVD System


CC-200 is a compact and easy-to-use system for Research and Development use and production.


High-density plasma process on 27.12MHz

Supports the deposition of SiH4 (SiO2, SiNx, SiON, α-Si) and TEOS (SiO2).

Supports chamber cleaning by CF4+O2 plasma.

Supports the heater for low-temperature deposition of organic EL.

Supports various substrate sizes.

Vacuum box-enabled indirect sequential processing within C-series (Sputter : CS-200, Evaporation : CV-200).



Power devices.

Compound-related devices of LED, LD and high-speed devices.

Organic EL system for R&D use.

Solar battery system for R&D use.



Contact us for more product information and specifications.


2024 ULVAC Singapore Pte Ltd. All rights reserved.