Accurate measurement of thermal diffusivity of a wide variety of sheet materials from diamond to polymer.

Applicable to a wide variety of materials, including stand-alone seet, film and other materials, from 3 to 500 µm.

Measurement of the thermal conductivity of 100 to 1000 nm thick film deposited on a test substrate by the differential method.

Simple operation for measurement

Control, measurement and analysis with exclusive software

Houses all optical, control and measurement systems in one compact bench-top module.

Measurements of thermal diffusivity and thermal conductivity of high-thermal conductivity sheet materials (thickness < 500 µm) such as CVD diamond and aluminium nitride.

Measurements of thermal diffusivity and thermal conductivity of various metal sheet materials (thickness > 5 µm) such as copper, nickel, and stainless steel.

Measurements of thermal diffusivity and thermal conductivity of low-thermal conductivity sheet materials (thickness < 500 µm) such as glass and resin materials.

Measurements of thermal diffusivity and thermal conductivity of polymer films such as PET and polyimide (thickness > 5 µm) and anisotropic high-thermal conductivity graphite sheets (thickness < 100 µm).

Measurements of thermal conductivity of aluminium nitride thin films and aluminium oxide thin films (thickness 100 to 300 nm) formed on glass substrates (thickness 30 µm).

Measurements of thermal conductivity of DLC thin films (thickness > 1 µm) formed on glass substrates (thickness 0.03 mm).

Measurements of thermal conductivity of organic dye thin films (thickness 100 to 300 nm) formed on PET substrates (thickness 0.1 mm).

Evaluations of target materials for sputtering.

∗ Measurement conditions may change depending on the material of a sample and its physical values. The conditions mentioned in the catalog are rough standards.